MC8640DTHX1067NE
vs
MC8640DHX1067NE
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
BGA
Package Description
33 X 33 MM, CERAMIC, FCBGA-1023
FCBGA-1023
Pin Count
1023
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.1
3A991.A.1
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
166.66 MHz
166.66 MHz
External Data Bus Width
32
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CBGA-B1023
S-CBGA-B1023
JESD-609 Code
e0
e0
Length
33 mm
33 mm
Low Power Mode
YES
NO
Moisture Sensitivity Level
3
3
Number of Terminals
1023
1023
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
HBGA
Package Equivalence Code
BGA1023,32X32,40
BGA1023,32X32,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel)
245
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.97 mm
2.97 mm
Speed
1067 MHz
1067 MHz
Supply Voltage-Max
1 V
1 V
Supply Voltage-Min
0.9 V
0.9 V
Supply Voltage-Nom
0.95 V
0.95 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
33 mm
33 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
Samacsys Manufacturer
NXP
Number of DMA Channels
4
Compare MC8640DTHX1067NE with alternatives
Compare MC8640DHX1067NE with alternatives