MC74VHC1G14DFR2 vs 74HC1G14GW,125 feature comparison

MC74VHC1G14DFR2 onsemi

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74HC1G14GW,125 NXP Semiconductors

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ON SEMICONDUCTOR NXP SEMICONDUCTORS
Part Package Code SOT-353 TSSOP
Package Description TSSOP, PLASTIC, SC-88A, 5 PIN
Pin Count 5 5
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e0 e3
Length 2 mm 2 mm
Logic IC Type INVERTER INVERTER
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 20.5 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish TIN LEAD Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.25 mm 1.25 mm
Base Number Matches 3 2
Manufacturer Package Code SOT353-1
ECCN Code EAR99
Load Capacitance (CL) 50 pF
Max I(ol) 0.002 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 38 ns
Schmitt Trigger YES
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74HC1G14GW,125 with alternatives