MC74LCX32DR2G vs N74LVC32AD-T feature comparison

MC74LCX32DR2G Rochester Electronics LLC

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N74LVC32AD-T NXP Semiconductors

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Pbfree Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code SOIC
Package Description LEAD FREE, SOIC-14 SOP,
Pin Count 14
Reach Compliance Code unknown unknown
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e3
Length 8.65 mm 8.65 mm
Logic IC Type OR GATE OR GATE
Moisture Sensitivity Level NOT SPECIFIED
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 6.6 ns 5 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 1.2 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm 3.9 mm
Base Number Matches 2 1
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF

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