MC74LCX258DTR2 vs 74LVC1G157GW,125 feature comparison

MC74LCX258DTR2 Motorola Mobility LLC

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74LVC1G157GW,125 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code TSSOP TSSOP
Package Description TSSOP, PLASTIC, SC-88, SOT-363, 6 PIN
Pin Count 16 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G6
Length 5 mm 2 mm
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 9 ns 13 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.1 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 2.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 1.25 mm
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT363
Samacsys Manufacturer NXP
JESD-609 Code e3
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP6,.08
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6.3 ns
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 30

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Compare 74LVC1G157GW,125 with alternatives