74LVC1G157GW,125 vs MC74LCX157DT feature comparison

74LVC1G157GW,125 NXP Semiconductors

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MC74LCX157DT Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code TSSOP
Package Description PLASTIC, SC-88, SOT-363, 6 PIN TSSOP, TSSOP16,.25
Pin Count 6
Manufacturer Package Code SOT363
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-G16
JESD-609 Code e3 e0
Length 2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1
Number of Functions 1 4
Number of Inputs 2 2
Number of Outputs 1
Number of Terminals 6 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP6,.08 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6.3 ns 5.8 ns
Propagation Delay (tpd) 13 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1.25 mm
Base Number Matches 2 5
Power Supplies 3.3 V

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