74LVC1G157GW,125
vs
MC74LCX157DT
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
Part Package Code |
TSSOP
|
|
Package Description |
PLASTIC, SC-88, SOT-363, 6 PIN
|
TSSOP, TSSOP16,.25
|
Pin Count |
6
|
|
Manufacturer Package Code |
SOT363
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
NXP
|
|
Family |
LVC/LCX/Z
|
|
JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G16
|
JESD-609 Code |
e3
|
e0
|
Length |
2 mm
|
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Max I(ol) |
0.024 A
|
0.024 A
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
|
Number of Terminals |
6
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
TRUE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP6,.08
|
TSSOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
6.3 ns
|
5.8 ns
|
Propagation Delay (tpd) |
13 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
1.65 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.635 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.25 mm
|
|
Base Number Matches |
2
|
5
|
Power Supplies |
|
3.3 V
|
|
|
|
Compare 74LVC1G157GW,125 with alternatives