MC74LCX158DT
vs
MC74LCX257MEL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ON SEMICONDUCTOR
ROCHESTER ELECTRONICS LLC
Part Package Code
TSSOP
SOIC
Package Description
TSSOP, TSSOP16,.25
EIAJ, SO-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Factory Lead Time
4 Weeks
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e4
Length
5 mm
10.2 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
NOT SPECIFIED
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
6.5 ns
Propagation Delay (tpd)
8.5 ns
7.2 ns
Qualification Status
Not Qualified
COMMERCIAL
Seated Height-Max
1.2 mm
2.05 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
2.7 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
5.275 mm
Base Number Matches
4
2
Pbfree Code
Output Characteristics
3-STATE
Time@Peak Reflow Temperature-Max (s)
40
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