MC74LCX158DT vs IDT74LVC257APY8 feature comparison

MC74LCX158DT onsemi

Buy Now Datasheet

IDT74LVC257APY8 Integrated Device Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code TSSOP SOIC
Package Description TSSOP, TSSOP16,.25 SSOP,
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 5 mm 6.2 mm
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SSOP
Package Equivalence Code TSSOP16,.25 SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Packing Method RAIL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 6.5 ns
Propagation Delay (tpd) 8.5 ns 5.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.99 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2.7 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.3 mm
Base Number Matches 4 1
Output Characteristics 3-STATE
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74LCX158DT with alternatives

Compare IDT74LVC257APY8 with alternatives