MC74LCX139DTR2G vs TC74HC138AP(F) feature comparison

MC74LCX139DTR2G onsemi

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TC74HC138AP(F) Toshiba America Electronic Components

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Pbfree Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ONSEMI TOSHIBA CORP
Part Package Code TSSOP-16 DIP
Package Description TSSOP-16 DIP,
Pin Count 16 16
Manufacturer Package Code 948F-01
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks 20 Weeks
Samacsys Manufacturer onsemi Toshiba
Family LVC/LCX/Z HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e4
Length 5 mm 19.25 mm
Logic IC Type 2-LINE TO 4-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.024 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 6.2 ns 38 ns
Propagation Delay (tpd) 9.3 ns 190 ns
Qualification Status Not Qualified
Seated Height-Max 1.2 mm 4.45 mm
Supply Voltage-Max (Vsup) 3.6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3.3 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 4.4 mm 7.62 mm
Base Number Matches 1 1
Rohs Code Yes
Load Capacitance (CL) 50 pF

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