MC74HCT573ADW vs TC74HCT573AFW(TP1) feature comparison

MC74HCT573ADW Motorola Mobility LLC

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TC74HCT573AFW(TP1) Toshiba America Electronic Components

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Part Life Cycle Code Transferred Active
Ihs Manufacturer MOTOROLA INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature BROADSIDE VERSION OF 373 BROADSIDE VERSION OF 373; ENABLE TIME @ RL=1K
Family HCT HCT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0
Length 12.8 mm 12.8 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 45 ns 46 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.7 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.5 mm
Base Number Matches 2 3
Pbfree Code No
Rohs Code No
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74HCT573ADW with alternatives

Compare TC74HCT573AFW(TP1) with alternatives