MC74HCT245AFR1 vs TC74HCT245AF(TP2) feature comparison

MC74HCT245AFR1 onsemi

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TC74HCT245AF(TP2) Toshiba America Electronic Components

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Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ON SEMICONDUCTOR TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0 e0
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 33 ns 38 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Additional Feature WITH DIRECTION CONTROL; ENABLE TIME @ RL=1K
Length 12.8 mm
Load Capacitance (CL) 150 pF
Peak Reflow Temperature (Cel) 240
Seated Height-Max 1.9 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.3 mm

Compare MC74HCT245AFR1 with alternatives

Compare TC74HCT245AF(TP2) with alternatives