MC74HCT138ADR2
vs
TC74HCT138AFN(ELP)
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Lifetime Buy
Ihs Manufacturer
ONSEMI
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOIC-16
SOP,
Pin Count
16
16
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
Additional Feature
3 ENABLE INPUTS
3 ENABLE INPUTS
Family
HCT
HCT
Input Conditioning
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e0
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
3-LINE TO 8-LINE DECODER
OTHER DECODER/DRIVER
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
Peak Reflow Temperature (Cel)
235
240
Prop. Delay@Nom-Sup
45 ns
Propagation Delay (tpd)
45 ns
44 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
4
1
Pbfree Code
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC74HCT138ADR2 with alternatives
Compare TC74HCT138AFN(ELP) with alternatives