MC74HC75N vs CD54HC112F/3 feature comparison

MC74HC75N Motorola Mobility LLC

Buy Now Datasheet

CD54HC112F/3 Harris Semiconductor

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC HARRIS SEMICONDUCTOR
Part Package Code DIP
Package Description DIP, ,
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-CDIP-T16
JESD-609 Code e0
Length 19.175 mm
Load Capacitance (CL) 50 pF
Logic IC Type D LATCH J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 44 ns 265 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.44 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL NEGATIVE EDGE
Width 7.62 mm
Base Number Matches 2 2
fmax-Min 60 MHz

Compare MC74HC75N with alternatives

Compare CD54HC112F/3 with alternatives