MC74HC74AFELG
vs
HD74HC74FP-E
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
ONSEMI
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
HALOGEN FREE AND ROHS COMPLIANT, EIAJ, SO-14
|
SOP,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e4
|
|
Length |
10.2 mm
|
10.06 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
20000000 Hz
|
|
Max I(ol) |
0.004 A
|
|
Number of Bits |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
150 ns
|
200 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.05 mm
|
2.2 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
5.275 mm
|
5.5 mm
|
fmax-Min |
24 MHz
|
|
Base Number Matches |
1
|
3
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare MC74HC74AFELG with alternatives
Compare HD74HC74FP-E with alternatives