MC74HC4316AN
vs
MC74HC4316ADR2
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP16,.3
|
SOP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
|
| Length |
19.175 mm
|
9.9 mm
|
| Neg Supply Voltage-Max (Vsup) |
-6 V
|
-6 V
|
| Neg Supply Voltage-Min (Vsup) |
|
|
| Neg Supply Voltage-Nom (Vsup) |
-4.5 V
|
|
| Normal Position |
NO
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
40 dB
|
40 dB
|
| On-state Resistance Match-Nom |
25 Ω
|
20 Ω
|
| On-state Resistance-Max (Ron) |
130 Ω
|
160 Ω
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.44 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
2 V
|
| Surface Mount |
NO
|
YES
|
| Switch-off Time-Max |
60 ns
|
130 ns
|
| Switch-on Time-Max |
60 ns
|
140 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
5
|
4
|
|
|
|
Compare MC74HC4316AN with alternatives
Compare MC74HC4316ADR2 with alternatives