MC74HC4066N vs HEF4066BT,652 feature comparison

MC74HC4066N Motorola Mobility LLC

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HEF4066BT,652 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP SOIC
Package Description DIP, DIP14,.3 PLASTIC, SO-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Length 18.86 mm 8.65 mm
Normal Position NO NO
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 40 dB 50 dB
On-state Resistance Match-Nom 20 Ω 5 Ω
On-state Resistance-Max (Ron) 130 Ω 175 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output SEPARATE OUTPUT SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm 1.75 mm
Supply Current-Max (Isup) 0.16 mA
Supply Voltage-Nom (Vsup) 12 V 15 V
Surface Mount NO YES
Switch-off Time-Max 15 ns 140 ns
Switch-on Time-Max 15 ns 30 ns
Switching MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Rohs Code Yes
Manufacturer Package Code SOT108-1
Samacsys Manufacturer NXP
Moisture Sensitivity Level 1
Neg Supply Voltage-Nom (Vsup)
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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Compare HEF4066BT,652 with alternatives