MC74HC4066ADR2G vs HEF4051BDF feature comparison

MC74HC4066ADR2G onsemi

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HEF4051BDF NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI NXP SEMICONDUCTORS
Part Package Code SOIC-14 NB DIP
Package Description SOIC-14 DIP,
Pin Count 14 16
Manufacturer Package Code 751A-03
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Analog IC - Other Type SPST SINGLE-ENDED MULTIPLEXER
JESD-30 Code R-PDSO-G14 R-GDIP-T16
JESD-609 Code e3
Length 8.65 mm
Moisture Sensitivity Level 1
Normal Position NO
Number of Channels 1 8
Number of Functions 4 1
Number of Terminals 14 16
Off-state Isolation-Nom 40 dB 50 dB
On-state Resistance Match-Nom 20 Ω 5 Ω
On-state Resistance-Max (Ron) 120 Ω 175 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 12 V 15 V
Supply Voltage-Min (Vsup) 2 V 3 V
Supply Voltage-Nom (Vsup) 3 V 15 V
Surface Mount YES NO
Switch-off Time-Max 60 ns 230 ns
Switch-on Time-Max 45 ns 80 ns
Switching MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Neg Supply Voltage-Nom (Vsup)

Compare MC74HC4066ADR2G with alternatives

Compare HEF4051BDF with alternatives