MC74HC4050DDR2
vs
M74HC4050RM13TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
STMICROELECTRONICS
Package Description
SOP,
SOP, SOP16,.25
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CMOS-TTL LEVEL TRANSLATOR
CMOS-TTL LEVEL TRANSLATOR
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
150 pF
Logic IC Type
BUFFER
BUFFER
Number of Functions
6
6
Number of Inputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
26 ns
150 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Part Package Code
SOIC
Pin Count
16
Samacsys Manufacturer
STMicroelectronics
JESD-609 Code
e4
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
Package Equivalence Code
SOP16,.25
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
23 ns
Schmitt Trigger
NO
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
30
Compare MC74HC4050DDR2 with alternatives
Compare M74HC4050RM13TR with alternatives