Findchips: Compare MC74HC4050DDR2 vs 74HC4050D,652

MC74HC4050DDR2 vs 74HC4050D,652 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Transferred
Ihs Manufacturer	MOTOROLA INC	NXP SEMICONDUCTORS
Package Description	SOP,	SO-16
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Additional Feature	CMOS-TTL LEVEL TRANSLATOR	CMOS-TTL LEVEL TRANSLATOR
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G16	R-PDSO-G16
Length	9.9 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	BUFFER	BUFFER
Number of Functions	6	6
Number of Inputs	1	1
Number of Terminals	16	16
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-55 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Propagation Delay (tpd)	26 ns	26 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.75 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	MILITARY	AUTOMOTIVE
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Width	3.9 mm
Base Number Matches	2	2
Rohs Code		Yes
Part Package Code		SOP
Pin Count		16
Manufacturer Package Code		SOT109-1
ECCN Code		EAR99
JESD-609 Code		e4
Max I(ol)		0.004 A
Moisture Sensitivity Level		1
Package Equivalence Code		SOP16,.25
Peak Reflow Temperature (Cel)		260
Prop. Delay@Nom-Sup		26 ns
Schmitt Trigger		NO
Terminal Finish		Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)		30
	Logic » Gates	Logic » Gates