MC74HC374ADWR2 vs 74HC374U feature comparison

MC74HC374ADWR2 Motorola Mobility LLC

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74HC374U NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code SOIC DIE
Package Description SOP, ,
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 X-XUUC-N
JESD-609 Code e0
Length 12.8 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Shape RECTANGULAR UNSPECIFIED
Package Style SMALL OUTLINE UNCASED CHIP
Propagation Delay (tpd) 38 ns 250 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Width 7.5 mm
Base Number Matches 1 1
Package Equivalence Code DIE OR CHIP

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