74HC374U vs MM74HC374SJ feature comparison

74HC374U NXP Semiconductors

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MM74HC374SJ Rochester Electronics LLC

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Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Part Package Code DIE SOIC
Package Description , SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code X-XUUC-N R-PDSO-G20
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE SOP
Package Equivalence Code DIE OR CHIP
Package Shape UNSPECIFIED RECTANGULAR
Package Style UNCASED CHIP SMALL OUTLINE
Propagation Delay (tpd) 250 ns 288 ns
Qualification Status Not Qualified COMMERCIAL
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Position UPPER DUAL
Base Number Matches 2 3
Pbfree Code Yes
Rohs Code Yes
Pin Count 20
JESD-609 Code e3
Length 12.6 mm
Moisture Sensitivity Level 1
Number of Terminals 20
Peak Reflow Temperature (Cel) 260
Seated Height-Max 2.1 mm
Terminal Finish MATTE TIN
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm

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