MC74HC30N vs CD74HC30E feature comparison

MC74HC30N Motorola Mobility LLC

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CD74HC30E General Electric Solid State

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC GENERAL ELECTRIC SOLID STATE
Part Package Code DIP
Package Description DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH
JESD-30 Code R-PDIP-T14
JESD-609 Code e0
Length 18.86 mm
Load Capacitance (CL) 50 pF
Logic IC Type NAND GATE
Number of Functions 1
Number of Inputs 8
Number of Terminals 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Propagation Delay (tpd) 53 ns
Qualification Status Not Qualified
Seated Height-Max 4.69 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm
Base Number Matches 5 7

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