MC74HC175AN
vs
MC74HC175ANG
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
ONSEMI
Part Package Code
DIP
DIP
Package Description
DIP,
HALOGENE FREE AND ROHS COMPLIANT, PLASTIC, DIP-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
e3
Length
19.175 mm
19.175 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
4
1
Number of Functions
1
4
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
32 ns
225 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
4.44 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
25 MHz
24 MHz
Base Number Matches
5
2
Pbfree Code
Rohs Code
Factory Lead Time
4 Weeks
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
Package Equivalence Code
DIP16,.3
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Compare MC74HC175AN with alternatives
Compare MC74HC175ANG with alternatives