MC74HC175AN
vs
HD74HC75P
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ONSEMI
RENESAS ELECTRONICS CORP
Part Package Code
DIP
DIP
Package Description
PLASTIC, DIP-16
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Family
HC/UH
HC/UH
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e0
Length
19.175 mm
19.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D LATCH
Max Frequency@Nom-Sup
20000000 Hz
Max I(ol)
0.004 A
0.004 A
Number of Bits
4
2
Number of Functions
1
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
235
Propagation Delay (tpd)
225 ns
180 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
5.06 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3 V
4.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Trigger Type
POSITIVE EDGE
HIGH LEVEL
Width
7.62 mm
7.62 mm
fmax-Min
24 MHz
Base Number Matches
5
2
Pbfree Code
Yes
Moisture Sensitivity Level
1
Prop. Delay@Nom-Sup
31 ns
Compare MC74HC175AN with alternatives
Compare HD74HC75P with alternatives