MC74HC158ADR2
vs
54HST157FL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
GEC PLESSEY SEMICONDUCTORS
Package Description
0.150 INCH, PLASTIC, SOIC-16
,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
kg CO2e/kg
12.6
Average Weight (mg)
162.05
CO2e (mg)
2041.83
Category CO2 Kg
12.6
12.6
Compliance Temperature Grade
Military: -55C to +125C
Military: -55C to +125C
Family
HC/UH
HST/T
JESD-30 Code
R-PDSO-G16
R-CDFP-F16
JESD-609 Code
e0
Length
9.9 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.0024 A
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DFP
Package Equivalence Code
SOP16,.25
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
FLATPACK
Packing Method
TR
Prop. Delay@Nom-Sup
110 ns
Propagation Delay (tpd)
38 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
Base Number Matches
1
1
Compare MC74HC158ADR2 with alternatives
Compare 54HST157FL with alternatives