MC74HC158ADR2
vs
54LS153LMQB
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
Package Description
SOP, SOP16,.25
QCCN, LCC20,.35SQ
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LS
JESD-30 Code
R-PDSO-G16
S-CQCC-N20
JESD-609 Code
e0
Length
9.9 mm
8.89 mm
Load Capacitance (CL)
50 pF
15 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.0024 A
0.004 A
Number of Functions
4
2
Number of Inputs
2
4
Number of Outputs
1
1
Number of Terminals
16
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
QCCN
Package Equivalence Code
SOP16,.25
LCC20,.35SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER
Packing Method
TR
Prop. Delay@Nom-Sup
110 ns
35 ns
Propagation Delay (tpd)
38 ns
35 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.905 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
QUAD
Width
3.9 mm
8.89 mm
Base Number Matches
3
4
Power Supply Current-Max (ICC)
10 mA
Screening Level
MIL-STD-883 Class B
Compare MC74HC158ADR2 with alternatives
Compare 54LS153LMQB with alternatives