MC74HC132ANG
vs
MC74HC132ADDR2
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
Part Package Code |
DIP
|
|
Package Description |
DIP-14
|
SOP,
|
Pin Count |
14
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
onsemi
|
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
JESD-609 Code |
e3
|
|
Length |
18.86 mm
|
8.65 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Max I(ol) |
0.004 A
|
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Prop. Delay@Nom-Sup |
38 ns
|
|
Propagation Delay (tpd) |
190 ns
|
38 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
YES
|
|
Seated Height-Max |
4.69 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
7.62 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MC74HC132ANG with alternatives
Compare MC74HC132ADDR2 with alternatives