MC74F38JD
vs
54F38/BCA
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
DIP,
|
DIP, DIP14,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
|
| JESD-30 Code |
R-GDIP-T14
|
R-XDIP-T14
|
| Length |
19.495 mm
|
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Number of Functions |
4
|
|
| Number of Inputs |
2
|
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
30 mA
|
30 mA
|
| Propagation Delay (tpd) |
5.5 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Max I(ol) |
|
0.02 A
|
| Package Equivalence Code |
|
DIP14,.3
|
| Prop. Delay@Nom-Sup |
|
14.5 ns
|
| Schmitt Trigger |
|
NO
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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