MC74F38JD
vs
54F38/BCA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
PHILIPS SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
JESD-30 Code
R-GDIP-T14
R-XDIP-T14
Length
19.495 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Characteristics
OPEN-COLLECTOR
OPEN-COLLECTOR
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
30 mA
30 mA
Propagation Delay (tpd)
5.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Max I(ol)
0.02 A
Package Equivalence Code
DIP14,.3
Prop. Delay@Nom-Sup
14.5 ns
Schmitt Trigger
NO
Screening Level
38535Q/M;38534H;883B
Terminal Finish
Tin/Lead (Sn/Pb)
Compare MC74F38JD with alternatives