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Overview of 54F38/BCA by Philips Semiconductors
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
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CAD Models for 54F38/BCA by Philips Semiconductors
Part Data Attributes for 54F38/BCA by Philips Semiconductors
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|
|
|---|---|
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Rohs Code
|
No
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|
Part Life Cycle Code
|
Transferred
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|
Ihs Manufacturer
|
PHILIPS SEMICONDUCTORS
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|
Package Description
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DIP, DIP14,.3
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|
Reach Compliance Code
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unknown
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HTS Code
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8542.39.00.01
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|
JESD-30 Code
|
R-XDIP-T14
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|
JESD-609 Code
|
e0
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Logic IC Type
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NAND GATE
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|
Max I(ol)
|
0.02 A
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Number of Terminals
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14
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Operating Temperature-Max
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125 °C
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Operating Temperature-Min
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-55 °C
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Output Characteristics
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OPEN-COLLECTOR
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Package Body Material
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CERAMIC
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Package Code
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DIP
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Package Equivalence Code
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DIP14,.3
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Package Shape
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RECTANGULAR
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Package Style
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IN-LINE
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Power Supply Current-Max (ICC)
|
30 mA
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Prop. Delay@Nom-Sup
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14.5 ns
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Qualification Status
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Not Qualified
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Schmitt Trigger
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NO
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Screening Level
|
38535Q/M;38534H;883B
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Supply Voltage-Nom (Vsup)
|
5 V
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Surface Mount
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NO
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Technology
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TTL
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Temperature Grade
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MILITARY
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Terminal Finish
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Tin/Lead (Sn/Pb)
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Terminal Form
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THROUGH-HOLE
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Terminal Pitch
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2.54 mm
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Terminal Position
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DUAL
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