MC74F174N
vs
N54F174/B2A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Package Description
PLASTIC, DIP-16
QCCN,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
F/FAST
JESD-30 Code
R-PDIP-T16
S-CQCC-N20
JESD-609 Code
e0
Length
19.175 mm
8.89 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
6
6
Number of Functions
1
1
Number of Terminals
16
20
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Power Supply Current-Max (ICC)
45 mA
45 mA
Propagation Delay (tpd)
11 ns
11.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
1.905 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
8.89 mm
fmax-Min
80 MHz
80 MHz
Base Number Matches
4
1
Part Package Code
QLCC
Pin Count
20
Compare MC74F174N with alternatives
Compare N54F174/B2A with alternatives