MC74F174N vs MC74F174J feature comparison

MC74F174N Freescale Semiconductor

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MC74F174J Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0 e0
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 80000000 Hz 80000000 Hz
Max I(ol) 0.02 A 0.02 A
Number of Functions 6 1
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5 V
Power Supply Current-Max (ICC) 45 mA 45 mA
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 3 3
Part Package Code DIP
Pin Count 16
HTS Code 8542.39.00.01
Family F/FAST
Length 19.495 mm
Number of Bits 6
Output Polarity TRUE
Propagation Delay (tpd) 11 ns
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Width 7.62 mm
fmax-Min 140 MHz

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