MC74ACT138DG vs TC74HC138AP(F) feature comparison

MC74ACT138DG Rochester Electronics LLC

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TC74HC138AP(F) Toshiba America Electronic Components

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Pbfree Code No
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC TOSHIBA CORP
Part Package Code SOIC DIP
Package Description PLASTIC, SOIC-16 DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS
Family ACT HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e3
Length 9.9 mm 19.25 mm
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 11.5 ns 190 ns
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 4.5 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
Factory Lead Time 20 Weeks
Samacsys Manufacturer Toshiba
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 38 ns
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC74ACT138DG with alternatives

Compare TC74HC138AP(F) with alternatives