MC74AC259DG vs SN74LS174NS feature comparison

MC74AC259DG onsemi

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SN74LS174NS Motorola Mobility LLC

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Pbfree Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer ONSEMI MOTOROLA INC
Part Package Code SOIC 16 LEAD DIP
Package Description SOIC-16 DIP, DIP16,.3
Pin Count 16 16
Manufacturer Package Code 751B-05
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 2 Days
Samacsys Manufacturer onsemi
Additional Feature 1:8 DMUX FOLLOWED BY LATCH
Family AC LS
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e3 e0
Length 9.9 mm 20.07 mm
Load Capacitance (CL) 50 pF
Logic IC Type D LATCH D FLIP-FLOP
Max I(ol) 0.012 A
Moisture Sensitivity Level 1
Number of Bits 1 6
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 17 ns
Propagation Delay (tpd) 17 ns 30 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.25 V
Supply Voltage-Min (Vsup) 2 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish MATTE TIN TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type LOW LEVEL POSITIVE EDGE
Width 3.9 mm 7.62 mm
Base Number Matches 1 1
Rohs Code No
fmax-Min 40 MHz

Compare MC74AC259DG with alternatives

Compare SN74LS174NS with alternatives