MC7448VS1400ND
vs
MC7447AHX600NB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.1
3A991.A.1
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
4 Weeks
4 Weeks
Address Bus Width
36
Bit Size
32
32
Boundary Scan
NO
YES
Clock Frequency-Max
1400 MHz
167 MHz
External Data Bus Width
64
Format
FIXED POINT
FLOATING POINT
Integrated Cache
NO
YES
JESD-30 Code
S-CBGA-N360
S-CBGA-B360
Length
25 mm
25 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
1
1
Number of Terminals
360
360
Operating Temperature-Max
105 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
LGA
BGA
Package Equivalence Code
LGA360,19X19,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.8 mm
3.24 mm
Speed
1400 MHz
600 MHz
Supply Voltage-Max
1.2 V
1.35 V
Supply Voltage-Min
1.1 V
1.25 V
Supply Voltage-Nom
1.15 V
1.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Form
NO LEAD
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
40
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
2
Samacsys Manufacturer
NXP
Additional Feature
ALSO REQUIRES 1.8V OR 2.5V SUPPLY
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
Compare MC7448VS1400ND with alternatives
Compare MC7447AHX600NB with alternatives