MC68HC908RF2MFA
vs
MC68HC908RF2CFA
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LQFP, QFP32,.35SQ,32
|
|
| Pin Count |
32
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
YES
|
| Additional Feature |
OPERATES AT 2V SUPPLY @ 2MHZ
|
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
68HC08
|
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G32
|
|
| Length |
7 mm
|
7 mm
|
| Number of I/O Lines |
12
|
12
|
| Number of Terminals |
32
|
32
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
LQFP
|
LQFP
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
128
|
|
| ROM (words) |
2048
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
4 MHz
|
4 MHz
|
| Supply Current-Max |
8.6 mA
|
|
| Supply Voltage-Max |
3.3 V
|
3.3 V
|
| Supply Voltage-Min |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
2018-04-13
|
|
|
|