MC68HC908LK24CPK
vs
MC68HC908LJ24CPK
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP, QFP80,.55SQ,20
|
LQFP-80
|
| Pin Count |
80
|
80
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
OPERATES AT 2.97 V MINIMUM SUPPLY @ 4 MHZ
|
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
68HC08
|
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G80
|
| Length |
12 mm
|
12 mm
|
| Number of I/O Lines |
48
|
48
|
| Number of Terminals |
80
|
80
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP80,.55SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
768
|
|
| ROM (words) |
24576
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Speed |
8 MHz
|
8 MHz
|
| Supply Current-Max |
20 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
12 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
2
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|