MC68HC908GR4CDW
vs
MC68HC908GZ60MFA
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
SOIC
|
QFP
|
| Package Description |
SOP, SOP28,.4
|
LQFP-48
|
| Pin Count |
28
|
48
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
EAR99
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
OPERATES AT 3V SUPPLY @ 4.1 MHZ
|
OPERATES AT 3.3 V SUPPLY @ 4 MHZ
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
68HC08
|
68HC08
|
| Clock Frequency-Max |
32.8 MHz
|
32 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G28
|
S-PQFP-G48
|
| Length |
17.9 mm
|
7 mm
|
| Number of I/O Lines |
17
|
37
|
| Number of Terminals |
28
|
48
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LFQFP
|
| Package Equivalence Code |
SOP28,.4
|
QFP48,.35SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
384
|
2048
|
| ROM (words) |
4096
|
61440
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.65 mm
|
1.6 mm
|
| Speed |
8.2 MHz
|
8 MHz
|
| Supply Current-Max |
20 mA
|
30 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.5 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
5
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC68HC908GR4CDW with alternatives
Compare MC68HC908GZ60MFA with alternatives