MC68HC908GZ60MFA
vs
MC908GZ60CFA
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Part Package Code |
QFP
|
|
Package Description |
LFQFP, QFP48,.35SQ,20
|
LFQFP,
|
Pin Count |
48
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
OPERATES AT 3.3 V SUPPLY @ 4 MHZ
|
OPERATES AT 3.3V SUPPLY @ 4MHZ
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
68HC08
|
|
Clock Frequency-Max |
32 MHz
|
32 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G48
|
S-PQFP-G48
|
Length |
7 mm
|
7 mm
|
Number of I/O Lines |
37
|
37
|
Number of Terminals |
48
|
48
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
LFQFP
|
Package Equivalence Code |
QFP48,.35SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
2048
|
|
ROM (words) |
61440
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
1.6 mm
|
Speed |
8 MHz
|
8 MHz
|
Supply Current-Max |
30 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
7 mm
|
7 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
3
|
3
|
|
|
|
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