MC68HC11K0VFU2
vs
MC68HC11K0VFU2
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
Package Description |
QFP-80
|
14 X 14 MM, PLASTIC, QFP-80
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
4 CHIP SELECT SIGNALS
|
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
NO
|
CPU Family |
6800
|
|
Clock Frequency-Max |
8 MHz
|
8 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
S-PQFP-G80
|
S-PQFP-G80
|
JESD-609 Code |
e0
|
|
Length |
14 mm
|
14 mm
|
Low Power Mode |
YES
|
|
Number of DMA Channels |
|
|
Number of External Interrupts |
2
|
|
Number of I/O Lines |
62
|
62
|
Number of Serial I/Os |
2
|
|
Number of Terminals |
80
|
80
|
Number of Timers |
1
|
|
On Chip Data RAM Width |
8
|
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP80,.68SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
768
|
|
RAM (words) |
768
|
|
ROM Programmability |
MROM
|
|
Seated Height-Max |
2.45 mm
|
2.45 mm
|
Speed |
2 MHz
|
2 MHz
|
Supply Current-Max |
35 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|