MC68HC11E9MFN1R2
vs
MC68HC11E20FN3
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
LCC
|
|
| Package Description |
QCCJ,
|
|
| Pin Count |
52
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
YES
|
|
| Address Bus Width |
16
|
|
| Bit Size |
8
|
|
| Clock Frequency-Max |
12 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
S-PQCC-J52
|
|
| Length |
19.1262 mm
|
|
| Number of I/O Lines |
38
|
|
| Number of Terminals |
52
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
NO
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QCCJ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
|
| Qualification Status |
Not Qualified
|
|
| ROM Programmability |
MROM
|
|
| Seated Height-Max |
4.57 mm
|
|
| Speed |
3 MHz
|
|
| Supply Current-Max |
27 mA
|
|
| Supply Voltage-Max |
5 V
|
|
| Supply Voltage-Min |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
J BEND
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
19.1262 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
5
|
|
|
|
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