MC68HC11E9MFN1R2
vs
MC68HC11E0MFN3
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
QCCJ,
|
QCCJ,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
12 MHz
|
12 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQCC-J52
|
S-PQCC-J52
|
Length |
19.1262 mm
|
19.125 mm
|
Number of I/O Lines |
38
|
38
|
Number of Terminals |
52
|
52
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
ROM Programmability |
MROM
|
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Speed |
3 MHz
|
3 MHz
|
Supply Current-Max |
27 mA
|
|
Supply Voltage-Max |
5 V
|
5.5 V
|
Supply Voltage-Min |
5 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
HCMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
19.1262 mm
|
19.125 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
3
|
Part Package Code |
|
LCC
|
Pin Count |
|
52
|
ECCN Code |
|
EAR99
|
Supply Voltage-Nom |
|
5 V
|
|
|
|
Compare MC68HC11E9MFN1R2 with alternatives
Compare MC68HC11E0MFN3 with alternatives