MC68HC11E0CB3
vs
MC68HC11E9BCB2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
SDIP, SDIP56,.6
|
0.070 INCH PITCH, SDIP-56
|
Pin Count |
56
|
56
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
CPU Family |
6800
|
6800
|
Clock Frequency-Max |
12 MHz
|
8 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
R-PDIP-T56
|
R-PDIP-T56
|
JESD-609 Code |
e0
|
|
Length |
52.07 mm
|
52.07 mm
|
Number of I/O Lines |
38
|
38
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SDIP
|
SDIP
|
Package Equivalence Code |
SDIP56,.6
|
SDIP56,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE, SHRINK PITCH
|
IN-LINE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
512
|
512
|
ROM Programmability |
MROM
|
MROM
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Speed |
3 MHz
|
2 MHz
|
Supply Current-Max |
35 mA
|
27 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
1.778 mm
|
1.778 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
On Chip Program ROM Width |
|
8
|
ROM (words) |
|
12288
|
|
|
|
Compare MC68HC11E0CB3 with alternatives
Compare MC68HC11E9BCB2 with alternatives