MC68HC11E0CB3
vs
MC68HC11E9VB2
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIP
|
|
Package Description |
0.070 INCH PITCH, SDIP-56
|
SDIP-56
|
Pin Count |
56
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
CPU Family |
6800
|
68HC11
|
Clock Frequency-Max |
12 MHz
|
8 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
R-PDIP-T56
|
R-PDIP-T56
|
Length |
52.07 mm
|
52.07 mm
|
Number of I/O Lines |
38
|
38
|
Number of Terminals |
56
|
56
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SDIP
|
SDIP
|
Package Equivalence Code |
SDIP56,.6
|
SDIP56,.6
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE, SHRINK PITCH
|
IN-LINE, SHRINK PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
512
|
512
|
Seated Height-Max |
5.08 mm
|
5.08 mm
|
Speed |
3 MHz
|
2 MHz
|
Supply Current-Max |
35 mA
|
27 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
HCMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
1.778 mm
|
1.778 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
15.24 mm
|
15.24 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
5
|
5
|
Boundary Scan |
|
NO
|
Format |
|
FIXED POINT
|
Integrated Cache |
|
NO
|
Low Power Mode |
|
YES
|
On Chip Data RAM Width |
|
8
|
On Chip Program ROM Width |
|
8
|
ROM (words) |
|
12000
|
ROM Programmability |
|
MROM
|
|
|
|
Compare MC68HC11E0CB3 with alternatives
Compare MC68HC11E9VB2 with alternatives