MC68HC11E0CB3 vs MC68HC11E9VB2 feature comparison

MC68HC11E0CB3 Freescale Semiconductor

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MC68HC11E9VB2 NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code DIP
Package Description 0.070 INCH PITCH, SDIP-56 SDIP-56
Pin Count 56
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width 16 16
Bit Size 8 8
CPU Family 6800 68HC11
Clock Frequency-Max 12 MHz 8 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T56 R-PDIP-T56
Length 52.07 mm 52.07 mm
Number of I/O Lines 38 38
Number of Terminals 56 56
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SDIP SDIP
Package Equivalence Code SDIP56,.6 SDIP56,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, SHRINK PITCH IN-LINE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512 512
Seated Height-Max 5.08 mm 5.08 mm
Speed 3 MHz 2 MHz
Supply Current-Max 35 mA 27 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology HCMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 1.778 mm 1.778 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 5 5
Boundary Scan NO
Format FIXED POINT
Integrated Cache NO
Low Power Mode YES
On Chip Data RAM Width 8
On Chip Program ROM Width 8
ROM (words) 12000
ROM Programmability MROM

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