MC68HC000FN12R2
vs
UPD70216L8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
RENESAS ELECTRONICS CORP
Part Package Code
LCC
LCC
Package Description
QCCJ,
Pin Count
68
68
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Address Bus Width
23
20
Bit Size
32
16
Boundary Scan
NO
NO
Clock Frequency-Max
12 MHz
16 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQCC-J68
S-PQCC-J68
Length
24.2062 mm
24.2 mm
Low Power Mode
NO
YES
Number of DMA Channels
4
Number of External Interrupts
7
8
Number of Serial I/Os
1
Number of Terminals
68
68
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-10 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
4.57 mm
4.6 mm
Speed
12 MHz
8 MHz
Supply Current-Max
35 mA
90 mA
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Width
24.2062 mm
24.2 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
1
Pbfree Code
Rohs Code
Additional Feature
THREE 16-BIT TIMER; DYNAMIC REFRESH CONTROL
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC68HC000FN12R2 with alternatives
Compare UPD70216L8 with alternatives