UPD70216L8
vs
MC68HC000FN16
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOTOROLA INC
Part Package Code
LCC
Pin Count
68
Reach Compliance Code
unknown
unknown
Additional Feature
THREE 16-BIT TIMER; DYNAMIC REFRESH CONTROL
Address Bus Width
20
23
Bit Size
16
32
Boundary Scan
NO
NO
Clock Frequency-Max
16 MHz
16.67 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-PQCC-J68
S-PQCC-J68
JESD-609 Code
e0
e0
Length
24.2 mm
24.2062 mm
Low Power Mode
YES
NO
Number of DMA Channels
4
Number of External Interrupts
8
7
Number of Serial I/Os
1
Number of Terminals
68
68
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-10 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
4.6 mm
4.57 mm
Speed
8 MHz
16.67 MHz
Supply Current-Max
90 mA
50 mA
Supply Voltage-Max
5.5 V
5.25 V
Supply Voltage-Min
4.5 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
24.2 mm
24.2062 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
3
Package Description
PLASTIC, LCC-68
HTS Code
8542.31.00.01
Package Equivalence Code
LDCC68,1.0SQ
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