MC68EC020FG25
vs
NG80386SX-20F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
ADVANCED MICRO DEVICES INC
Part Package Code
QFP
QFP
Package Description
QFP, QFP100,.7X1.0
PLASTIC, QFP-100
Pin Count
100
100
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Additional Feature
DYNAMIC BUS SIZING; 3 PIPELINE STAGES
Address Bus Width
24
23
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
25 MHz
40 MHz
External Data Bus Width
32
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
NO
JESD-30 Code
R-PQFP-G100
S-PQFP-F100
JESD-609 Code
e0
e0
Length
20 mm
19 mm
Low Power Mode
NO
NO
Number of DMA Channels
Number of External Interrupts
8
2
Number of Serial I/Os
Number of Terminals
100
100
On Chip Data RAM Width
Operating Temperature-Max
70 °C
100 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
GQFF
Package Equivalence Code
QFP100,.7X1.0
TAPEPAK,100P,.025
Package Shape
RECTANGULAR
SQUARE
Package Style
FLATPACK
FLATPACK, GUARD RING
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
0
Seated Height-Max
3.1 mm
4.8 mm
Speed
25 MHz
20 MHz
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
FLAT
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
19 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Supply Current-Max
305 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC68EC020FG25 with alternatives
Compare NG80386SX-20F with alternatives