MC68908GR16MFJE
vs
MC908GZ60CFU
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
13 Weeks
|
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-609 Code |
e3
|
|
| Length |
7 mm
|
14 mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
32
|
64
|
| Package Code |
LQFP
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
7 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
3
|
| Part Package Code |
|
QFP
|
| Package Description |
|
QFP,
|
| Pin Count |
|
64
|
| Has ADC |
|
YES
|
| Additional Feature |
|
OPERATES AT 3.3V SUPPLY @ 4MHZ
|
| Address Bus Width |
|
|
| Bit Size |
|
8
|
| Clock Frequency-Max |
|
32 MHz
|
| DAC Channels |
|
NO
|
| DMA Channels |
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
|
S-PQFP-G64
|
| Number of I/O Lines |
|
53
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| PWM Channels |
|
YES
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Style |
|
FLATPACK
|
| Qualification Status |
|
Not Qualified
|
| ROM Programmability |
|
FLASH
|
| Seated Height-Max |
|
2.45 mm
|
| Speed |
|
8 MHz
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Supply Voltage-Nom |
|
5 V
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Position |
|
QUAD
|
|
|
|
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