MC68175FA vs SL6679/KG/TP1Q feature comparison

MC68175FA Motorola Mobility LLC

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SL6679/KG/TP1Q Dynex Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC GEC PLESSEY SEMICONDUCTORS
Part Package Code QFP
Package Description LQFP, TQFP,
Pin Count 32
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G32 S-PQFP-G32
JESD-609 Code e0
Length 7 mm 7 mm
Number of Functions 1 1
Number of Terminals 32 32
Operating Temperature-Max 85 °C 55 °C
Operating Temperature-Min -30 °C -10 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP TQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.2 mm
Supply Voltage-Nom 2 V 1.3 V
Surface Mount YES YES
Technology CMOS BIPOLAR
Telecom IC Type PAGING DECODER PAGING RECEIVER
Temperature Grade OTHER COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 7 mm 7 mm
Base Number Matches 1 1
Supply Current-Max 2.4 mA

Compare MC68175FA with alternatives

Compare SL6679/KG/TP1Q with alternatives