MC68030FE25C
vs
MC68EC030CFE25C
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Part Package Code |
QFP
|
QFN
|
| Package Description |
QFP,
|
QCCJ,
|
| Pin Count |
132
|
132
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
25 MHz
|
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-CQFP-G132
|
X-CQCC-J132
|
| Length |
22.355 mm
|
|
| Low Power Mode |
NO
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
7
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
132
|
132
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFP
|
QCCJ
|
| Package Shape |
SQUARE
|
UNSPECIFIED
|
| Package Style |
FLATPACK
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.31 mm
|
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
HCMOS
|
| Terminal Form |
GULL WING
|
J BEND
|
| Terminal Pitch |
0.635 mm
|
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
22.355 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
DYNAMIC BUS SIZING;UPTO 9.2 MIPS
|
| Operating Temperature-Max |
|
70 °C
|
| Temperature Grade |
|
COMMERCIAL
|
|
|
|
Compare MC68030FE25C with alternatives
Compare MC68EC030CFE25C with alternatives