MC68030FE20C
vs
TS68020MFB/C16
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
THOMSON-CSF SEMICONDUCTORS
Part Package Code
QFP
QFP
Package Description
QFP,
,
Pin Count
132
132
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
20 MHz
16.67 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-CQFP-G132
S-CQFP-G132
Length
22.355 mm
Low Power Mode
NO
YES
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
Number of Terminals
132
132
On Chip Data RAM Width
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.31 mm
Speed
20 MHz
16.67 MHz
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
HCMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
22.355 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
ECCN Code
3A001.A.2.C
Operating Temperature-Max
125 °C
Screening Level
MIL-STD-883 Class B
Temperature Grade
MILITARY
Compare MC68030FE20C with alternatives
Compare TS68020MFB/C16 with alternatives