MC68030FE20C
vs
TS68020VF20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
TELEDYNE E2V (UK) LTD
Part Package Code
QFP
QFP
Package Description
QFP,
CERAMIC, QFP-132
Pin Count
132
132
Reach Compliance Code
unknown
unknown
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
20 MHz
20 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
YES
JESD-30 Code
S-CQFP-G132
S-CQFP-G132
Length
22.355 mm
24.13 mm
Low Power Mode
NO
YES
Moisture Sensitivity Level
1
Number of Terminals
132
132
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
260
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
4.31 mm
3.43 mm
Speed
20 MHz
20 MHz
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
HCMOS
Terminal Finish
NOT SPECIFIED
Gold (Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Width
22.355 mm
24.13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
4
5
Rohs Code
HTS Code
8542.31.00.01
JESD-609 Code
e4
Operating Temperature-Max
85 °C
Package Equivalence Code
QFP132,1.2SQ
Supply Current-Max
333 mA
Temperature Grade
INDUSTRIAL
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